tinytechjobs
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Singapore,
SGP
The successful candidate will lead the packaging team and work with systems team for integration of a complex implantable wireless neural system device. The specific task will involve :
* Design and development of assembly methods for Si based 3-D probe arrays.
* Design and characterization of bonding/interconnection materials and system level assembly consisting of sensor probe arrays, IC, RF passive devices.
* Design and characterization assembly and interconnection method of discrete devices for wireless module.
* Design and develop flexible cable for interconnection.
* Conduct reliability test, failure analysis and performance improvement of the system packaging.
Requirements:
* PhD degree in Material Science/Mechanical Engineering, preferably with industrial or post doctor research experience in advanced electronic packaging or MEMS packaging.
* Familiarity with wafer processing (i.e. lithography, deposition, dry etching, etc.), specifically MEMS technologies.
* Self-motivated and proactive team player with ability t
* work as a part of multidisciplinary team
* Good analytical and problem solving skills
* Good oral and written communications skills.
Application Info:
Our Rewards
As we believe in recruiting only the best, we offer successful candidates premier remuneration package and attractive benefits plans which include Annual Wage Supplement, Performance Bonuses, Medical & Life Insurance Plans and Relocation Benefits
We invite you to apply with your full resume, including current and expected salaries, relevant experience and contact number(s).
Posted: 2009-12-17 09:50:24
Singapore, SGP
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